PCB Manufacturing

Specifications and Tolerance

Complete range of PCB manufacturing & assembly services with precise specifications and tolerances to suit your requirements

Board Characteristics

Specifications for various board characteristics

SpecificationStandardAdvanced
Minimum Layer Count0101
Maximum Layer Count1632
Trace/Space0.005″0.003″
Controlled Impedance+/- 10%+/- 5%
Annular Ring0.005″0.003″ Mechanical, 0.001″ Laser
Outer Layers Finished Copper1 oz to 2 oz1 oz to 4 oz
Inner Layers Finished Copper0.5 oz to 2 oz0.3 oz to 3 oz
Filled ViasN/ANon-Conductive Fill or Conductive Fill
Smallest Mechanical Drill Diameter0.006″0.004″
Smallest Laser Drill Diameter0.004″N/A
Blind ViasNoYes
Buried ViasNoYes
Aspect Ratio10:0115:01
Plated Hole to Copper0.008″0.005″
Clearance – Copper to Edge of Board (Outer Layer)0.010″0.005″
Clearance – Copper to Edge of Board (Inner Layer)0.015″0.005″
Minimum Panel Size9″ x 12″8″ x 8″
Maximum Panel Size18″ x 24″24″ x 36″
Plated SlotsRoutedRouted or Nibbled
Non-Plated SlotsRoutedRouted or Nibbled
Plating in Holes0.0008″0.0015″
Web Soldermask (DAM)0.004″0.004″
Soldermask Clearance0.003″0.001″
Silkscreen Width0.005″0.003″