
Specifications and Tolerance
Complete range of PCB manufacturing & assembly services with precise specifications and tolerances to suit your requirements
Board Characteristics
Specifications for various board characteristics
Specification | Standard | Advanced |
---|---|---|
Minimum Layer Count | 01 | 01 |
Maximum Layer Count | 16 | 32 |
Trace/Space | 0.005″ | 0.003″ |
Controlled Impedance | +/- 10% | +/- 5% |
Annular Ring | 0.005″ | 0.003″ Mechanical, 0.001″ Laser |
Outer Layers Finished Copper | 1 oz to 2 oz | 1 oz to 4 oz |
Inner Layers Finished Copper | 0.5 oz to 2 oz | 0.3 oz to 3 oz |
Filled Vias | N/A | Non-Conductive Fill or Conductive Fill |
Smallest Mechanical Drill Diameter | 0.006″ | 0.004″ |
Smallest Laser Drill Diameter | 0.004″ | N/A |
Blind Vias | No | Yes |
Buried Vias | No | Yes |
Aspect Ratio | 10:01 | 15:01 |
Plated Hole to Copper | 0.008″ | 0.005″ |
Clearance – Copper to Edge of Board (Outer Layer) | 0.010″ | 0.005″ |
Clearance – Copper to Edge of Board (Inner Layer) | 0.015″ | 0.005″ |
Minimum Panel Size | 9″ x 12″ | 8″ x 8″ |
Maximum Panel Size | 18″ x 24″ | 24″ x 36″ |
Plated Slots | Routed | Routed or Nibbled |
Non-Plated Slots | Routed | Routed or Nibbled |
Plating in Holes | 0.0008″ | 0.0015″ |
Web Soldermask (DAM) | 0.004″ | 0.004″ |
Soldermask Clearance | 0.003″ | 0.001″ |
Silkscreen Width | 0.005″ | 0.003″ |