Design Limits
Understanding PCB manufacturing design limits is crucial for creating reliable and manufacturable circuit boards. These specifications define the technical boundaries and capabilities of our manufacturing process.
All Printed Circuit Boards are produced in accordance with applicable certifications, standards, and tailored to meet specific customer requirements. We also offer the capability to deliver a wide range of board types, including those with tight tolerances and unique specifications. For specialized needs or custom requests, our team is ready to collaborate—let’s discuss how we can support your project.
| Descriptional Images | Specification | Standard Design | Intermediate Design | Significant Design |
|---|---|---|---|---|
 | Minimum Trace Width | 0.005" | 0.003" | 0.002" |
 | Outer Layer Via Pad Size | Class 3: 2 Mil, and capable up to landless via | 0.005" | 0.003" |
 | Line to Line Spacing | 0.005" / 0.005" | 0.003" / 0.003" | 0.002" / 0.002" |
| Minimum Through Hole Drilled | 0.008" | 0.006" | 0.004" |
 | Minimum Buried Via Drilled | 0.008" | 0.006" | 0.004" |
 | Minimum Blind Via Drilled | 0.008" | 0.006" | 0.004" |
 | Blind Via Aspect Ratio | 8:1 Aspect Ratio | 1:1 | 1:1 |
 | Maximum PCB Thickness | 300 mil | 0.008-0.125" | 0.002"-0.4" |
 | Number of Layers | 12 Layers | 22 layers | 40 layers |
 | Controlled Impedance Tolerance | +- 5% or Under Tolerance | -0.05 | -0.025 |
 | Maximum Board Size | 19.5" X 22.5" | 20.5 X 24.5" | 20.5 X 26" |
 | Copper Thickness/Density | Able to meet customer requirements | .25-2 oz | 5 microns-20 oz |
 | Minimum Drill-to-Conductor | 6 Mil (edge of hole to track) | 0.005" | 0.003" |
 | PCB Edge to Conductor | 0.010" | 0.005" | 0.002" |
 | Warp (Bow and Twist) | Exceeds IPC-TM-650 | exceeds IPC Spec | exceeds IPC Spec |
 | Solder Mask DAM | 0.010" | 0.005" | 0.002" |